NS2 - Incorporating spirobisindane into the molecular structure of epoxy polymers to reduce the coefficient of thermal expansion.
SCURS Disciplines
Chemistry
Document Type
General Presentation (Oral)
Invited Presentation Choice
Service-Learning — Oral
Abstract
Incorporating spirobisindane into the molecular structure of epoxy polymers has shown to reduce the coefficient of thermal expansion. This reduction is due to the highly rigid and twisted structure which restricts the mobility of molecular chains. A spirobisindane-based epoxy has been synthesized and characterized using IR, 1H NMR and 13CNMR spectroscopy. In addition, varying amounts of the spirobisindane-based epoxy have been polymerized with an amine curing agent. The coefficient of thermal expansion, glass transition temperatures and moduli will be given and compared to the original epoxy system.
Keywords
spirobisindane, epoxy
Start Date
10-4-2026 2:25 PM
Location
CASB 105
End Date
10-4-2026 2:40 PM
NS2 - Incorporating spirobisindane into the molecular structure of epoxy polymers to reduce the coefficient of thermal expansion.
CASB 105
Incorporating spirobisindane into the molecular structure of epoxy polymers has shown to reduce the coefficient of thermal expansion. This reduction is due to the highly rigid and twisted structure which restricts the mobility of molecular chains. A spirobisindane-based epoxy has been synthesized and characterized using IR, 1H NMR and 13CNMR spectroscopy. In addition, varying amounts of the spirobisindane-based epoxy have been polymerized with an amine curing agent. The coefficient of thermal expansion, glass transition temperatures and moduli will be given and compared to the original epoxy system.