Whisker Nucleation in Indentation Residual Stress Field on Tin Plated Component Leads

Author(s)

Jin Liang
Zhi-Hui Xu
Xiaodong Li, University of South Carolina - ColumbiaFollow

Document Type

Article

Publication Info

Published in Journal of Materials Science: Materials in Electronics, Volume 18, Issue 6, 2007, pages 599-604.

©Journal of Materials Science: Materials in Electronics 2007, Springer.

Liang, J., Xu, Z.-H., & Li, X. (1 June 2007). Whisker Nucleation in Indentation Residual Stress Field on Tin Plated Component Leads. Journal of Materials Science: Materials in Electronics, 18 (60), 599 – 604. http://dx.doi.org/10.1007/s10854-007-9153-4

Rights

©Journal of Materials Science: Materials in Electronics 2007, Springer.

Liang, J., Xu, Z.-H., & Li, X. (1 June 2007). Whisker Nucleation in Indentation Residual Stress Field on Tin Plated Component Leads. Journal of Materials Science: Materials in Electronics, 18 (60), 599 – 604. http://dx.doi.org/10.1007/s10854-007-9153-4