Linear sweep voltammetry, galvanostatic pulse, and pulse reverse techniques were used to study the plating of nickel-iron alloys in the presence of organic additives. The effects of pulse current densities, ip, reverse current densities, ir, rotation speed of disk electrode, and the presence of organic additives on deposition of nickel-iron alloys are evaluated. The observed phenomena can be explained by the concentration depletion of reactants (or products), and the surface coverage of the additives on the electrode. A new formulation of the plating bath is defined.
Journal of the Electrochemical Society, 1993, pages 1321-1330.
© The Electrochemical Society, Inc. 1993. All rights reserved. Except as provided under U.S. copyright law, this work may not be reproduced, resold, distributed, or modified without the express permission of The Electrochemical Society (ECS). The archival version of this work was published in the Journal of the Electrochemical Society.
Publisher's link: http://dx.doi.org/10.1149/1.2220978DOI: 10.1149/1.2220978