Structural Characterization of Silicon Films Deposited at Low Temperature by Remote Plasma Enhanced Chemical Vapor Deposition

Author(s)

Xiaodong Li, University of South Carolina - ColumbiaFollow
Young-Bae Park
Dong-Hwan Kim
Shi-Woo Rhee

Document Type

Article

Publication Info

Published in Materials Letters, Volume 24, Issue 1-3, 1995, pages 79-83.

©Materials Letters 1995, Elsevier.

Li, X., Park, Y-B., Kim, D-H., & Rhee, S-W. (June 1995). Structural Characterization of Silicon Films Deposited at Low Temperature by Remote Plasma enhanced Chemical Vapor Deposition. Materials Letters, 24 (1-3), 79 -83. http://dx.doi.org/10.1016/0167-577X(95)00085-2

Rights

©Materials Letters 1995, Elsevier.

Li, X., Park, Y-B., Kim, D-H., & Rhee, S-W. (June 1995). Structural Characterization of Silicon Films Deposited at Low Temperature by Remote Plasma enhanced Chemical Vapor Deposition. Materials Letters, 24 (1-3), 79 -83. http://dx.doi.org/10.1016/0167-577X(95)00085-2