CB-35 Low-Cost Reflow Soldering: Repurposing a Toaster Oven for Reflow Soldering

SCURS Disciplines

Computer Sciences

Document Type

Poster Presentation

Abstract

This project presents the design and implementation of a reflow oven controller system to convert a standard toaster oven into a functional reflow soldering oven. Reflow soldering is a critical process in electronics assembly, and access to a low-cost, customizable reflow oven can significantly benefit small-scale production, prototyping, and research applications. The developed controller regulates the toaster oven's heating elements, ensuring precise control over the temperature profiles necessary for effective reflow soldering. Key components of the system include temperature feedback, triac heater control, and MCU for control. The modified toaster oven is capable of replicating the thermal profiles typically achieved by low end commercial reflow ovens, offering an affordable alternative for hobbyists, engineers, and small electronics manufacturers. This work demonstrates the feasibility of repurposing common appliances to meet specialized technical requirements, highlighting the potential for cost-effective innovation in the field of electronics manufacturing.

Keywords

Reflow, IOT, PID

Start Date

11-4-2025 9:30 AM

Location

University Readiness Center Greatroom

End Date

11-4-2025 11:30 AM

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Apr 11th, 9:30 AM Apr 11th, 11:30 AM

CB-35 Low-Cost Reflow Soldering: Repurposing a Toaster Oven for Reflow Soldering

University Readiness Center Greatroom

This project presents the design and implementation of a reflow oven controller system to convert a standard toaster oven into a functional reflow soldering oven. Reflow soldering is a critical process in electronics assembly, and access to a low-cost, customizable reflow oven can significantly benefit small-scale production, prototyping, and research applications. The developed controller regulates the toaster oven's heating elements, ensuring precise control over the temperature profiles necessary for effective reflow soldering. Key components of the system include temperature feedback, triac heater control, and MCU for control. The modified toaster oven is capable of replicating the thermal profiles typically achieved by low end commercial reflow ovens, offering an affordable alternative for hobbyists, engineers, and small electronics manufacturers. This work demonstrates the feasibility of repurposing common appliances to meet specialized technical requirements, highlighting the potential for cost-effective innovation in the field of electronics manufacturing.